| Кількість | Ціна |
|---|---|
| 3+ | 140.94 грн |
| 10+ | 121.26 грн |
| 25+ | 99.85 грн |
| 84+ | 93.57 грн |
| 252+ | 85.19 грн |
| 504+ | 73.32 грн |
| 1008+ | 65.43 грн |
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Технічний опис 116-83-310-41-006101 Preci-dip
Description: CONN IC DIP SOCKET 10POS GOLD, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 10 (2 x 5), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Elevated, Open Frame, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper.
Інші пропозиції 116-83-310-41-006101
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
 |
116-83-310-41-006101 | Preci-Dip |
 Description: CONN IC DIP SOCKET 10POS GOLDContact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 10 (2 x 5) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper |
товару немає в наявності |
Мінімальне замовлення: 3528 шт В кошику од. на суму грн. |
| 116-83-310-41-006101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Description: CONN IC DIP SOCKET 10POS GOLD
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
товару немає в наявності
Мінімальне замовлення: 3528 шт
В кошику
од. на суму грн.