на замовлення 768 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 745.73 грн |
| 28+ | 625.82 грн |
| 112+ | 276.66 грн |
| 1008+ | 231.05 грн |
Відгуки про товар
Написати відгук
Технічний опис 117-43-620-41-005000 Mill-Max
Description: CONN IC DIP SOCKET 20POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.070" (1.78mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy.
Інші пропозиції 117-43-620-41-005000
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
117-43-620-41-005000 | Виробник : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 20POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |