на замовлення 435 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 735.98 грн |
| 10+ | 680.89 грн |
| 25+ | 514.55 грн |
| 100+ | 475.79 грн |
| 250+ | 433.23 грн |
| 1000+ | 391.42 грн |
| 2500+ | 371.66 грн |
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Технічний опис 12-823-90C Aries Electronics
Description: CONN IC DIP SOCKET 12POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Right Angle, Horizontal, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 12 (2 x 6), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass.
Інші пропозиції 12-823-90C
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
12-823-90C | Виробник : Aries Electronics |
 Description: CONN IC DIP SOCKET 12POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |