123-13-316-41-801000 Mill-Max Mfg. Corp.
Виробник: Mill-Max Mfg. Corp.Conn DIP Capacitor Socket SKT 16 POS 2.54mm Wire Wrap ST Thru-Hole Tube
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Технічний опис 123-13-316-41-801000 Mill-Max Mfg. Corp.
Description: CONN IC DIP SOCKET 16POS GOLD, Features: Open Frame, Decoupling Capacitor, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Wire Wrap, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass Alloy.
Інші пропозиції 123-13-316-41-801000
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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| 123-13-316-41-801000 | Виробник : Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 16POS GOLD Features: Open Frame, Decoupling Capacitor Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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123-13-316-41-801000 | Виробник : Mill-Max |
IC & Component Sockets 16P DIP SKT 3 LEVEL WRAPOST |
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