123-13-632-41-801000 Mill-Max Mfg. Corp.
Виробник: Mill-Max Mfg. Corp.Conn DIP Capacitor Socket SKT 32 POS 2.54mm Wire Wrap ST Thru-Hole Tube
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Технічний опис 123-13-632-41-801000 Mill-Max Mfg. Corp.
Description: CONN IC SKT DBL, Packaging: Tube, Features: Open Frame, Decoupling Capacitor, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Wire Wrap, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Інші пропозиції 123-13-632-41-801000
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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| 123-13-632-41-801000 | Виробник : Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame, Decoupling Capacitor Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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123-13-632-41-801000 | Виробник : Mill-Max |
IC & Component Sockets 32P DIP SKT 3 LEVEL WRAPOST |
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