| Кількість | Ціна |
|---|---|
| 1+ | 826.06 грн |
| 10+ | 721.91 грн |
| 20+ | 602.61 грн |
| 60+ | 564.21 грн |
| 100+ | 546.75 грн |
| 260+ | 498.57 грн |
| 500+ | 469.94 грн |
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Технічний опис 123-43-320-41-801000 Mill-Max
Description: CONN IC DIP SOCKET 20POS GOLD, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Wire Wrap, Number of Positions or Pins (Grid): 20 (2 x 10), Operating Temperature: -55°C ~ 125°C, Mounting Type: Through Hole, Features: Open Frame, Decoupling Capacitor, Packaging: Tube, Type: DIP, 0.3" (7.62mm) Row Spacing.
Інші пропозиції 123-43-320-41-801000
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
123-43-320-41-801000 | Виробник : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 20POS GOLDPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Wire Wrap Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -55°C ~ 125°C Mounting Type: Through Hole Features: Open Frame, Decoupling Capacitor Packaging: Tube Type: DIP, 0.3" (7.62mm) Row Spacing |
товару немає в наявності |