14-3501-30 Aries Electronics
| Кількість | Ціна |
|---|---|
| 1+ | 438.12 грн |
| 10+ | 391.00 грн |
| 25+ | 321.19 грн |
| 50+ | 313.53 грн |
| 100+ | 265.45 грн |
| 250+ | 257.79 грн |
| 500+ | 250.12 грн |
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Технічний опис 14-3501-30 Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN, Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Wire Wrap, Number of Positions or Pins (Grid): 14 (2 x 7), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm).
Інші пропозиції 14-3501-30
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 14-3501-30 | Виробник : Aries Electronics |
 Description: CONN IC DIP SOCKET 14POS TINContact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Wire Wrap Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) |
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