| Кількість | Ціна |
|---|---|
| 1+ | 732.37 грн |
| 10+ | 668.23 грн |
| 25+ | 534.39 грн |
| 50+ | 510.00 грн |
| 100+ | 503.03 грн |
| 250+ | 470.99 грн |
| 500+ | 431.27 грн |
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Технічний опис 14-823-90 Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD, Part Status: Active, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Termination: Solder, Number of Positions or Pins (Grid): 14 (2 x 7), Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Right Angle, Horizontal, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції 14-823-90 за ціною від 481.44 грн до 786.95 грн
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14-823-90 | Виробник : Aries Electronics |
 Description: CONN IC DIP SOCKET 14POS GOLDPart Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6 Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Packaging: Bulk |
на замовлення 314 шт: термін постачання 21-31 дні (днів) |
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