14-8350-310C Aries Electronics
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
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Технічний опис 14-8350-310C Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 14 (2 x 7), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Elevated, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper.
Інші пропозиції 14-8350-310C
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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14-8350-310C | Виробник : Aries Electronics |
IC & Component Sockets ELEV. SCKT .3 CENTER COLLET 14 PINS |
товару немає в наявності |