Результат пошуку "1437536-6" : 4
Вид перегляду :
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
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516-AG11D-ES | TE Connectivity / AMP |
 IC & Component Sockets SOLID FRAME PC 16P |
товар відсутній |
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| 516-AG11D-ES | TE Connectivity AMP Connectors |
Description: DIP SOCKET T/H 16POS Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Material - Post: Copper Alloy |
товар відсутній |
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520-AG11D-ES | TE Connectivity AMP Connectors |
Description: DIP SOCKET T/H 20POS Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Material - Post: Copper Alloy Part Status: Obsolete |
товар відсутній |
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528-AG11D-ES | TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25.0µin (0.63µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Material - Post: Copper Alloy |
товар відсутній |
| 516-AG11D-ES |
|
Виробник: TE Connectivity / AMP
IC & Component Sockets SOLID FRAME PC 16P
IC & Component Sockets SOLID FRAME PC 16P
товар відсутній
| 516-AG11D-ES |
|
Виробник: TE Connectivity AMP Connectors
Description: DIP SOCKET T/H 16POS
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Material - Post: Copper Alloy
Description: DIP SOCKET T/H 16POS
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Material - Post: Copper Alloy
товар відсутній
| 520-AG11D-ES |
|
Виробник: TE Connectivity AMP Connectors
Description: DIP SOCKET T/H 20POS
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Material - Post: Copper Alloy
Part Status: Obsolete
Description: DIP SOCKET T/H 20POS
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Material - Post: Copper Alloy
Part Status: Obsolete
товар відсутній
| 528-AG11D-ES |
|
Виробник: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Material - Post: Copper Alloy
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Material - Post: Copper Alloy
товар відсутній