Виробник: Weidmuller
Pluggable Terminal Blocks SL 5.08HC/12/180G 3.2SN OR BX

Виробник: Renesas / Dialog
RF System on a Chip - SoC Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols

Виробник: Renesas Electronics Corporation
Description: IC RF TXRX+MCU BLE 86VFBGA
Packaging: Cut Tape (CT)
Package / Case: 86-VFBGA
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Voltage - Supply: 2.4V ~ 4.75V
Power - Output: 6dBm
Protocol: Bluetooth v5.2
Supplier Device Package: 86-VFBGA (6x6)
GPIO: 20
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, I2S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified

Виробник: Renesas / Dialog
Daughter Cards & OEM Boards Bluetooth Low Energy DA14695 VFBGA86 daughterboard for the DA14695DEVKT-P Pro motherboard

Виробник: Renesas Electronics Corporation
Description: MULTI-CORE WIRELESS MCU FOR BLUE
Packaging: Box
For Use With/Related Products: DA14695
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)

Виробник: Renesas / Dialog
Bluetooth Development Tools - 802.15.1 Bluetooth Low Energy Development Kit Pro for DA1469x family: Includes motherboard, daughterboard and cables; Primary usage is SW application development and power measurements

Виробник: Renesas Electronics Corporation
Description: MULTI-CORE WIRELESS MCU FOR BLUE
Packaging: Box
For Use With/Related Products: DA14695
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Supplied Contents: Board(s), Cable(s)

Виробник: Renesas Electronics Corporation
Description: DA14695 WIRELESS RANGING DEV KIT
Packaging: Box
For Use With/Related Products: DA14695
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)

Виробник: Renesas / Dialog
Bluetooth Development Tools - 802.15.1 Bluetooth Low Energy Development Kit USB for DA1469x family: Includes USB board; Primary usage is SW application development

Виробник: Renesas Electronics Corporation
Description: MULTI-CORE WIRELESS MCU FOR BLUE
Packaging: Box
For Use With/Related Products: DA14695
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)

Виробник: Belden Inc.
Description: CABLE 5COND 22AWG CHROME
Packaging: Box
Length: 500.0' (152.4m)
Wire Gauge: 22 AWG
Jacket (Insulation) Material: Poly-Vinyl Chloride (PVC)
Conductor Strand: 7/30
Operating Temperature: -20°C ~ 80°C
Number of Conductors: 5
Cable Type: Multi-Conductor
Jacket (Insulation) Diameter: 0.194" (4.93mm)
Usage: Audio, Control, Instrumentation
Ratings: UL Style 2576
Jacket (Insulation) Thickness: 0.0320" (0.813mm)
Conductor Material: Copper, Tinned
Jacket Color: Chrome
Part Status: Active
Conductor Insulation: Poly-Vinyl Chloride (PVC)

Виробник: VISHAY
Description: VISHAY - ILQ615-2 - Optokoppler, Transistorausgang, 4 Kanäle, DIP, 16 Pin(s), 60 mA, 5.3 kV, 63 %
tariffCode: 85414900
rohsCompliant: YES
Anzahl der Kanäle: 4 Kanäle
hazardous: false
rohsPhthalatesCompliant: YES
CTR, min.: 63%
usEccn: EAR99
Isolationsspannung: 5.3kV
Durchlassstrom If, max.: 60mA
euEccn: NLR
Kollektor-Emitter-Spannung V(br)ceo: 70V
Bauform - Optokoppler: DIP
Anzahl der Pins: 16Pin(s)
Produktpalette: -
productTraceability: Yes-Date/Lot Code

Виробник: Weidmüller
Description: TERM BLOCK HDR 12POS VERT 5.08MM
Packaging: Bulk
Color: Orange
Mounting Type: Through Hole
Number of Positions: 12
Pitch: 0.200" (5.08mm)
Type: Header, Male Pins, Shrouded (4 Side)
Operating Temperature: -50°C ~ 100°C
Termination Style: Solder
Current - IEC: 24A
Number of Levels: 1
Positions Per Level: 12
Header Orientation: Vertical
Contact Mating Finish: Tin
Current - UL: 18.5 A
Voltage - IEC: 400 V
Voltage - UL: 300 V

Виробник: Renesas Electronics Corporation
Description: IC RF TXRX+MCU BLE 86VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 86-VFBGA
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Voltage - Supply: 2.4V ~ 4.75V
Power - Output: 6dBm
Protocol: Bluetooth v5.2
Supplier Device Package: 86-VFBGA (6x6)
GPIO: 20
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, I2S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified

Виробник: Renesas / Dialog
Bluetooth Development Tools - 802.15.1 Bluetooth Low Energy DA14695 Wireless Ranging Development Kit

Виробник: TE Connectivity / Raychem
Circular MIL Spec Strain Reliefs & Adapters TX41SJ00-1612

Виробник: RAF Electronic Hardware
Standoffs & Spacers HEX STANDOFF TAPPED THRU

Виробник: RAF Electronic Hardware
Standoffs & Spacers 13mm Hex X 22mm X M5 Thd

Виробник: RAF Electronic Hardware
Standoffs & Spacers 13mm Hex X 22mm X M5 Thd

Виробник: RAF Electronic Hardware
Standoffs & Spacers 13mm Hex X 22mm X M5 Thd

Виробник: RAF Electronic Hardware
Standoffs & Spacers 13mm Hex X 22mm X M5 Thd

Виробник: Vishay Semiconductor Opto Division
Description: OPTOISO 5.3KV 4CH TRANS 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Transistor
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 100°C
Voltage - Forward (Vf) (Typ): 1.15V
Input Type: DC
Current - Output / Channel: 50mA
Voltage - Isolation: 5300Vrms
Current Transfer Ratio (Min): 63% @ 10mA
Current Transfer Ratio (Max): 125% @ 10mA
Supplier Device Package: 16-DIP
Voltage - Output (Max): 70V
Turn On / Turn Off Time (Typ): 3µs, 2.3µs
Rise / Fall Time (Typ): 2µs, 2µs
Part Status: Active
Number of Channels: 4
Current - DC Forward (If) (Max): 60 mA

Виробник: TE Connectivity Aerospace, Defense and Marine
Description: CONN BCKSH ADP SZ16 17 15/16-20
Packaging: Bulk
Features: Tinel Lock
Material: Stainless Steel
Shielding: Unshielded
Thread Size: 15/16-20 UNEF
Type: Backshell, Heat Shrink Adapter
Shell Size - Insert: 16, 17
Cable Exit: 180°
Plating: Passivated
Diameter - Outside: 1.213" (30.80mm)