16-3501-20 Aries Electronics
| Кількість | Ціна |
|---|---|
| 1+ | 466.57 грн |
| 10+ | 415.84 грн |
| 25+ | 342.09 грн |
| 50+ | 333.73 грн |
| 100+ | 317.01 грн |
| 250+ | 278.69 грн |
| 500+ | 268.24 грн |
Відгуки про товар
Написати відгук
Технічний опис 16-3501-20 Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Wire Wrap, Number of Positions or Pins (Grid): 16 (2 x 8), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції 16-3501-20
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 16-3501-20 | Виробник : Aries Electronics |
 Description: CONN IC DIP SOCKET 16POS TINContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Wire Wrap Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
товару немає в наявності |