16-3501-20 Aries Electronics
на замовлення 104 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 530.94 грн |
| 10+ | 473.21 грн |
| 25+ | 389.29 грн |
| 50+ | 379.77 грн |
| 100+ | 360.75 грн |
| 250+ | 317.14 грн |
| 500+ | 305.25 грн |
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Технічний опис 16-3501-20 Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Wire Wrap, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Phosphor Bronze.
Інші пропозиції 16-3501-20
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 16-3501-20 | Виробник : Aries Electronics |
 Description: CONN IC DIP SOCKET 16POS TINPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |