Технічний опис 16-3518-112 Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 16 (2 x 8), Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk.
Інші пропозиції 16-3518-112
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| 16-3518-112 | Aries Electronics |
Description: CONN IC DIP SOCKET 16POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 16 (2 x 8) Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 70 шт В кошику од. на суму грн. | |
|
16-3518-112 | Aries Electronics |
IC & Component Sockets OPEN FRAME CAPACITOR SOLDER TAIL 16 PINS |
товару немає в наявності |
В кошику од. на суму грн. |
| 16-3518-112 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 70 шт
В кошику
од. на суму грн.
| 16-3518-112 |
![]() |
Виробник: Aries Electronics
IC & Component Sockets OPEN FRAME CAPACITOR SOLDER TAIL 16 PINS
IC & Component Sockets OPEN FRAME CAPACITOR SOLDER TAIL 16 PINS
товару немає в наявності
В кошику
од. на суму грн.



