16-820-90TWR Aries Electronics

Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
Відгуки про товар
Написати відгук
Технічний опис 16-820-90TWR Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Right Angle, Horizontal, Type: DIP, 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Phosphor Bronze.
Інші пропозиції 16-820-90TWR
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
---|---|---|---|---|---|
![]() |
16-820-90TWR | Виробник : Aries Electronics |
![]() |
товару немає в наявності |