Технічний опис 166-50130 HellermannTyton
Description: CONN IC DIP SOCKET 16POS TIN, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Wire Wrap, Number of Positions or Pins (Grid): 16 (2 x 8), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції 166-50130
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 16-6501-30 | Виробник : Aries Electronics |
 Description: CONN IC DIP SOCKET 16POS TINContact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Wire Wrap Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
товару немає в наявності |
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16-6501-30 | Виробник : Aries Electronics |
IC & Component Sockets WIRE WRAP BIFURCATED 16 PINS TIN |
товару немає в наявності |