1N6077US/TR Microchip Technology
Виробник: Microchip TechnologyDescription: UFR,FRR
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 1.3A
Supplier Device Package: E-MELF
Operating Temperature - Junction: -65°C ~ 155°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.76 V @ 18.8 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
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Технічний опис 1N6077US/TR Microchip Technology
Description: UFR,FRR, Packaging: Tape & Reel (TR), Package / Case: SQ-MELF, E, Mounting Type: Surface Mount, Speed: Fast Recovery =< 500ns, > 200mA (Io), Reverse Recovery Time (trr): 30 ns, Technology: Standard, Current - Average Rectified (Io): 1.3A, Supplier Device Package: E-MELF, Operating Temperature - Junction: -65°C ~ 155°C, Voltage - DC Reverse (Vr) (Max): 100 V, Voltage - Forward (Vf) (Max) @ If: 1.76 V @ 18.8 A, Current - Reverse Leakage @ Vr: 5 µA @ 100 V.
Інші пропозиції 1N6077US/TR
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1N6077US/TR | Виробник : Microchip Technology |
Description: UFR,FRR Packaging: Cut Tape (CT) Package / Case: SQ-MELF, E Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Current - Average Rectified (Io): 1.3A Supplier Device Package: E-MELF Operating Temperature - Junction: -65°C ~ 155°C Voltage - DC Reverse (Vr) (Max): 100 V Voltage - Forward (Vf) (Max) @ If: 1.76 V @ 18.8 A Current - Reverse Leakage @ Vr: 5 µA @ 100 V |
товару немає в наявності |