Технічний опис 2-1437539-9 TE Connectivity
Description: CONN IC DIP SOCKET 16POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 5.00µin (0.127µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm).
Інші пропозиції 2-1437539-9
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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2-1437539-9 | Виробник : TE Connectivity AMP Connectors |
 Description: CONN IC DIP SOCKET 16POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 5.00µin (0.127µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) |
товару немає в наявності |