2-1437539-9 TE CONNECTIVITY / PARTNER STOCK
Виробник: TE CONNECTIVITY / PARTNER STOCK
Description: TE CONNECTIVITY / PARTNER STOCK - 2-1437539-9 - IC AND COMPONENT SOCKETS
tariffCode: 85366930
productTraceability: No
SVHC: No SVHC (25-Jun-2025)
rohsCompliant: NO
euEccn: NLR
isCanonical: Y
hazardous: false
rohsPhthalatesCompliant: NO
usEccn: EAR99
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Технічний опис 2-1437539-9 TE CONNECTIVITY / PARTNER STOCK
Description: CONN IC DIP SOCKET 16POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 5.00µin (0.127µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm).
Інші пропозиції 2-1437539-9
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
2-1437539-9 | TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 16POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 5.00µin (0.127µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) |
товару немає в наявності |
Мінімальне замовлення: 1200 шт В кошику од. на суму грн. |
| 2-1437539-9 |
|
Виробник: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 5.00µin (0.127µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 5.00µin (0.127µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
товару немає в наявності
Мінімальне замовлення: 1200 шт
В кошику
од. на суму грн.