2-1571551-9

2-1571551-9 TE CONNECTIVITY / PARTNER STOCK


2563445.pdf Виробник: TE CONNECTIVITY / PARTNER STOCK
Description: TE CONNECTIVITY / PARTNER STOCK - 2-1571551-9 - IC- & Baustein-Sockel, 28 Kontakt(e), DIP-Sockel, 2.54 mm, DIPLOMATE 500, 15.24 mm
tariffCode: 85369010
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: DIP-Sockel
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 28Kontakt(e)
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 15.24mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: DIPLOMATE 500
SVHC: No SVHC (16-Jan-2020)
на замовлення 3400 шт:

термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
20+260.24 грн
Мінімальне замовлення: 20
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Технічний опис 2-1571551-9 TE CONNECTIVITY / PARTNER STOCK

Description: CONN IC DIP SOCKET 28POS GOLD, Packaging: Tube, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: FLASH, Contact Material - Post: Nickel.

Інші пропозиції 2-1571551-9

Фото Назва Виробник Інформація Доступність
Ціна без ПДВ
2-1571551-9 2-1571551-9 Виробник : TE Connectivity AMP Connectors DDEController?Action=srchrtrv&DocNm=1571551&DocType=Customer+Drawing&DocLang=English Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Nickel
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