Технічний опис 20-1508-21 Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD, Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.2" (5.08mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Termination: Wire Wrap, Number of Positions or Pins (Grid): 20 (2 x 10).
Інші пропозиції 20-1508-21
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| 20-1508-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 20POS GOLDOperating Temperature: -55°C ~ 125°C Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6 Termination: Wire Wrap Number of Positions or Pins (Grid): 20 (2 x 10) |
товару немає в наявності |
Мінімальне замовлення: 32 шт В кошику од. на суму грн. |
| 20-1508-21 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Wire Wrap
Number of Positions or Pins (Grid): 20 (2 x 10)
Description: CONN IC DIP SOCKET 20POS GOLD
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Wire Wrap
Number of Positions or Pins (Grid): 20 (2 x 10)
товару немає в наявності
Мінімальне замовлення: 32 шт
В кошику
од. на суму грн.



