20-1508-21 Aries Electronics
| Кількість | Ціна |
|---|---|
| 1+ | 1406.22 грн |
| 10+ | 1169.00 грн |
| 25+ | 903.65 грн |
| 100+ | 831.89 грн |
| 250+ | 801.93 грн |
| 500+ | 790.09 грн |
| 1000+ | 772.67 грн |
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Технічний опис 20-1508-21 Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD, Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.2" (5.08mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Termination: Wire Wrap, Number of Positions or Pins (Grid): 20 (2 x 10).
Інші пропозиції 20-1508-21
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 20-1508-21 | Виробник : Aries Electronics |
 Description: CONN IC DIP SOCKET 20POS GOLDOperating Temperature: -55°C ~ 125°C Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6 Termination: Wire Wrap Number of Positions or Pins (Grid): 20 (2 x 10) |
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