20-1508-30 Aries Electronics
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6
Termination: Wire Wrap
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Відгуки про товар
Написати відгук
Технічний опис 20-1508-30 Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD, Features: Closed Frame, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Termination: Wire Wrap, Number of Positions or Pins (Grid): 20 (2 x 10), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.2" (5.08mm) Row Spacing, Mounting Type: Through Hole.
Інші пропозиції 20-1508-30
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
20-1508-30 | Виробник : Aries Electronics |
IC & Component Sockets DUAL ROW COLLET WIRE WRAP 20 PINS |
товару немає в наявності |