20-1518-10 Aries Electronics
| Кількість | Ціна |
|---|---|
| 2+ | 262.55 грн |
| 10+ | 234.76 грн |
| 25+ | 193.69 грн |
| 100+ | 180.45 грн |
| 250+ | 157.46 грн |
| 500+ | 152.58 грн |
| 1000+ | 133.07 грн |
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Технічний опис 20-1518-10 Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 20 (2 x 10), Type: DIP, 0.2" (5.08mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk.
Інші пропозиції 20-1518-10
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 20-1518-10 | Виробник : Aries Electronics |
 Description: CONN IC DIP SOCKET 20POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
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