20-7400-10 Aries Electronics

Description: CONN SOCKET SIP 20POS TIN
Packaging: Bulk
Features: Elevated
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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Технічний опис 20-7400-10 Aries Electronics
Description: CONN SOCKET SIP 20POS TIN, Packaging: Bulk, Features: Elevated, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 20 (1 x 20), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Phosphor Bronze.
Інші пропозиції 20-7400-10
Фото | Назва | Виробник | Інформація |
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20-7400-10 | Виробник : Aries Electronics |
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товару немає в наявності |