200-6313-9UN-1900 3M Electronic Solutions Division
| Кількість | Ціна |
|---|---|
| 1+ | 5375.69 грн |
| 5+ | 5142.00 грн |
| 10+ | 4336.28 грн |
| 20+ | 4200.55 грн |
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Технічний опис 200-6313-9UN-1900 3M Electronic Solutions Division
Description: CONN SOCKET PGA ZIF 169POS GOLD, Part Status: Obsolete, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyethersulfone (PES), Termination: Solder, Number of Positions or Pins (Grid): 169 (13 x 13), Mounting Type: Through Hole, Packaging: Bulk, Operating Temperature: -55°C ~ 150°C, Type: PGA, ZIF (ZIP).
Інші пропозиції 200-6313-9UN-1900
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
200-6313-9UN-1900 | 3M |
 Description: CONN SOCKET PGA ZIF 169POS GOLDPart Status: Obsolete Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyethersulfone (PES) Termination: Solder Number of Positions or Pins (Grid): 169 (13 x 13) Mounting Type: Through Hole Packaging: Bulk Operating Temperature: -55°C ~ 150°C Type: PGA, ZIF (ZIP) |
товару немає в наявності |
В кошику од. на суму грн. |
| 200-6313-9UN-1900 |
|
Виробник: 3M
Description: CONN SOCKET PGA ZIF 169POS GOLD
Part Status: Obsolete
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyethersulfone (PES)
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Mounting Type: Through Hole
Packaging: Bulk
Operating Temperature: -55°C ~ 150°C
Type: PGA, ZIF (ZIP)
Description: CONN SOCKET PGA ZIF 169POS GOLD
Part Status: Obsolete
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyethersulfone (PES)
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Mounting Type: Through Hole
Packaging: Bulk
Operating Temperature: -55°C ~ 150°C
Type: PGA, ZIF (ZIP)
товару немає в наявності
В кошику
од. на суму грн.