2035643017 Molex
Виробник: MolexDescription: CONN HEADER SMD 30POS 1MM
Packaging: Tape & Reel (TR)
Features: Pick and Place, Solder Retention
Connector Type: Header
Voltage Rating: 50V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 30
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Contact Shape: Rectangular
Insulation Height: 0.213" (5.40mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon
Row Spacing - Mating: 0.105" (2.66mm)
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1100+ | 148.82 грн |
| 2200+ | 136.47 грн |
| 3300+ | 132.62 грн |
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Технічний опис 2035643017 Molex
Description: CONN HEADER SMD 30POS 1MM, Packaging: Tape & Reel (TR), Features: Pick and Place, Solder Retention, Connector Type: Header, Voltage Rating: 50V, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 30, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Friction Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Gold, Contact Shape: Rectangular, Insulation Height: 0.213" (5.40mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon, Row Spacing - Mating: 0.105" (2.66mm).
Інші пропозиції 2035643017 за ціною від 143.22 грн до 350.61 грн
| Фото | Назва | Виробник | Інформація |
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2035643017 | Виробник : Molex |
Description: CONN HEADER SMD 30POS 1MM Packaging: Cut Tape (CT) Features: Pick and Place, Solder Retention Connector Type: Header Voltage Rating: 50V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 30 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Friction Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Gold Contact Shape: Rectangular Insulation Height: 0.213" (5.40mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon Row Spacing - Mating: 0.105" (2.66mm) |
на замовлення 3569 шт: термін постачання 21-31 дні (днів) |
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203564-3017 | Виробник : Molex | Headers & Wire Housings PicoClasp Hdr SMT DR Vt 30CKT W/PL Au0.38 |
на замовлення 1356 шт: термін постачання 21-30 дні (днів) |
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203564-3017 | Виробник : MOLEX |
Description: MOLEX - 203564-3017 - Stiftleiste, Signal, Wire-to-Board, 1 mm, 2 Reihe(n), 30 Kontakt(e), Oberflächenmontage, gerade tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 30Kontakt(e) euEccn: NLR Steckverbindersysteme: Signal, Wire-to-Board Steckverbindertyp: PCB-Stiftleiste Produktpalette: Pico-Clasp 203564 Series productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 2Reihe(n) Rastermaß: 1mm SVHC: No SVHC (21-Jan-2025) |
на замовлення 3503 шт: термін постачання 21-31 дні (днів) |
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2035643017 | Виробник : Molex |
Conn Shrouded Header (4 Sides) HDR 30 POS 1mm Solder ST Top Entry SMD Pico-Clasp T/R |
товару немає в наявності |