2035643017 Molex
Виробник: Molex
Description: CONN HEADER SMD 30POS 1MM
Packaging: Tape & Reel (TR)
Features: Pick and Place, Solder Retention
Connector Type: Header
Voltage Rating: 50V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 30
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Contact Shape: Rectangular
Insulation Height: 0.213" (5.40mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon
Row Spacing - Mating: 0.105" (2.66mm)
| Кількість | Ціна без ПДВ |
|---|---|
| 1100+ | 156.50 грн |
| 2200+ | 143.52 грн |
| 3300+ | 139.48 грн |
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Технічний опис 2035643017 Molex
Description: CONN HEADER SMD 30POS 1MM, Packaging: Tape & Reel (TR), Features: Pick and Place, Solder Retention, Connector Type: Header, Voltage Rating: 50V, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 30, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Friction Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Gold, Contact Shape: Rectangular, Insulation Height: 0.213" (5.40mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyamide (PA), Nylon, Row Spacing - Mating: 0.105" (2.66mm).
Інші пропозиції 2035643017 за ціною від 145.22 грн до 245.65 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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2035643017 | Molex |
Description: CONN HEADER SMD 30POS 1MM Features: Pick and Place, Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 50V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 30 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Friction Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Gold Contact Shape: Rectangular Insulation Height: 0.213" (5.40mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon Row Spacing - Mating: 0.105" (2.66mm) |
на замовлення 4417 шт: термін постачання 21-31 дні (днів) |
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203564-3017 | Molex | Headers & Wire Housings PicoClasp Hdr SMT DR Vt 30CKT W/PL Au0.38 |
на замовлення 3767 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. |
| 2035643017 |
|
Виробник: Molex
Description: CONN HEADER SMD 30POS 1MM
Features: Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 50V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 30
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Contact Shape: Rectangular
Insulation Height: 0.213" (5.40mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon
Row Spacing - Mating: 0.105" (2.66mm)
Description: CONN HEADER SMD 30POS 1MM
Features: Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 50V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 30
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Contact Shape: Rectangular
Insulation Height: 0.213" (5.40mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon
Row Spacing - Mating: 0.105" (2.66mm)
на замовлення 4417 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 245.65 грн |
| 10+ | 200.88 грн |
| 100+ | 170.69 грн |
| 500+ | 145.22 грн |
| 203564-3017 |
Виробник: Molex
Headers & Wire Housings PicoClasp Hdr SMT DR Vt 30CKT W/PL Au0.38
Headers & Wire Housings PicoClasp Hdr SMT DR Vt 30CKT W/PL Au0.38
на замовлення 3767 шт:
термін постачання 21-30 дні (днів)