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Технічний опис 208-PGM17059-10 Aries Electronics
Description: SOCKET, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 208, Operating Temperature: -55°C ~ 105°C, Type: PGA, Mounting Type: Through Hole, Packaging: Bulk.
Інші пропозиції 208-PGM17059-10
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| 208-PGM17059-10 | Aries Electronics |
Description: SOCKET Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 208 Operating Temperature: -55°C ~ 105°C Type: PGA Mounting Type: Through Hole Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. |
| 208-PGM17059-10 |
Виробник: Aries Electronics
Description: SOCKET
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 208
Operating Temperature: -55°C ~ 105°C
Type: PGA
Mounting Type: Through Hole
Packaging: Bulk
Description: SOCKET
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 208
Operating Temperature: -55°C ~ 105°C
Type: PGA
Mounting Type: Through Hole
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.