| Кількість | Ціна |
|---|---|
| 1+ | 2449.91 грн |
| 10+ | 2310.76 грн |
| 25+ | 1817.75 грн |
| 50+ | 1780.13 грн |
| 100+ | 1665.17 грн |
| 250+ | 1640.79 грн |
| 500+ | 1632.42 грн |
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Технічний опис 208-PGM17059-10 Aries Electronics
Description: SOCKET, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 208, Operating Temperature: -55°C ~ 105°C, Type: PGA, Mounting Type: Through Hole, Packaging: Bulk.
Інші пропозиції 208-PGM17059-10
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 208-PGM17059-10 | Виробник : Aries Electronics |
Description: SOCKET Contact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 208 Operating Temperature: -55°C ~ 105°C Type: PGA Mounting Type: Through Hole Packaging: Bulk |
товару немає в наявності |