| Кількість | Ціна |
|---|---|
| 1+ | 723.41 грн |
| 10+ | 616.72 грн |
| 25+ | 503.46 грн |
| 50+ | 481.81 грн |
| 100+ | 457.37 грн |
| 250+ | 397.32 грн |
| 500+ | 358.22 грн |
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Технічний опис 210-13-308-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 8POS GOLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Інші пропозиції 210-13-308-41-001000 за ціною від 608.12 грн до 1060.51 грн
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210-13-308-41-001000 | Виробник : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 8POS GOLDFeatures: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 535 шт: термін постачання 21-31 дні (днів) |
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