| Кількість | Ціна |
|---|---|
| 1+ | 1177.18 грн |
| 10+ | 989.32 грн |
| 20+ | 822.57 грн |
| 60+ | 794.64 грн |
| 100+ | 778.58 грн |
| 260+ | 656.38 грн |
| 500+ | 598.42 грн |
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Технічний опис 210-13-320-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 20POS GOLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass Alloy.
Інші пропозиції 210-13-320-41-001000 за ціною від 1030.65 грн до 1322.88 грн
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210-13-320-41-001000 | Виробник : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 20POS GOLDFeatures: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
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