210-2599-00-0602 3M Electronic Solutions Division
Виробник: 3M Electronic Solutions Division
IC & Component Sockets .1" INLINE ZIP STRIP Socket 10 Contct Qt
| Кількість | Ціна |
|---|---|
| 1+ | 3261.18 грн |
| 10+ | 2791.87 грн |
| 30+ | 2281.66 грн |
| 50+ | 2183.12 грн |
| 100+ | 2110.45 грн |
| 250+ | 2070.61 грн |
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Технічний опис 210-2599-00-0602 3M Electronic Solutions Division
Description: CONN SOCKET SIP ZIF 10POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, ZIF (ZIP), Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 10 (1 x 10), Termination: Solder, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції 210-2599-00-0602
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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210-2599-00-0602 | Виробник : 3M |
Description: CONN SOCKET SIP ZIF 10POS GOLD Packaging: Bulk Mounting Type: Through Hole Type: SIP, ZIF (ZIP) Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (1 x 10) Termination: Solder Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
товару немає в наявності |