2100-6310-9UA-1902 3M
Виробник: 3M
Description: 10X10 GRID ZIP SOCKET
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyethersulfone (PES)
Termination: Solder
Number of Positions or Pins (Grid): 100 (10 x 10)
Operating Temperature: -55°C ~ 150°C
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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Технічний опис 2100-6310-9UA-1902 3M
Description: 10X10 GRID ZIP SOCKET, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyethersulfone (PES), Termination: Solder, Number of Positions or Pins (Grid): 100 (10 x 10), Operating Temperature: -55°C ~ 150°C, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції 2100-6310-9UA-1902
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
2100-6310-9UA-1902 | 3M Electronic Solutions Division |
 IC & Component Sockets 2100-6310-9UA-1902 GRID ZIP (10X10) |
товару немає в наявності |
В кошику од. на суму грн. |
| 2100-6310-9UA-1902 |
|
Виробник: 3M Electronic Solutions Division
IC & Component Sockets 2100-6310-9UA-1902 GRID ZIP (10X10)
IC & Component Sockets 2100-6310-9UA-1902 GRID ZIP (10X10)
товару немає в наявності
В кошику
од. на суму грн.