2100-6310-9UA-1902 3M
Виробник: 3M
Description: 10X10 GRID ZIP SOCKET
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 100 (10 x 10)
Termination: Solder
Housing Material: Polyethersulfone (PES)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Description: 10X10 GRID ZIP SOCKET
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 100 (10 x 10)
Termination: Solder
Housing Material: Polyethersulfone (PES)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
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Технічний опис 2100-6310-9UA-1902 3M
Description: 10X10 GRID ZIP SOCKET, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 100 (10 x 10), Termination: Solder, Housing Material: Polyethersulfone (PES), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper.
Інші пропозиції 2100-6310-9UA-1902
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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2100-6310-9UA-1902 | Виробник : 3M Electronic Solutions Division |
IC & Component Sockets 2100-6310-9UA-1902 GRID ZIP (10X10) |
товару немає в наявності |
