2125280801 Molex
| Кількість | Ціна без ПДВ |
|---|---|
| 55+ | 257.78 грн |
| 150+ | 253.08 грн |
| 250+ | 248.37 грн |
| 500+ | 234.06 грн |
| 1500+ | 212.52 грн |
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Технічний опис 2125280801 Molex
Description: R/A HDR 15 GOLD 2X4CKT, Packaging: Tray, Features: Board Lock, Connector Type: Header, Voltage Rating: 600VAC/DC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Through Hole, Right Angle, Number of Positions: 8, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Contact Length - Post: 0.125" (3.18mm), Insulation Height: 0.291" (7.40mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.118" (3.00mm).
Інші пропозиції 2125280801 за ціною від 201.18 грн до 373.43 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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2125280801 | Molex |
 Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry Thru-Hole Tray |
на замовлення 2483 шт: термін постачання 21-31 дні (днів) |
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2125280801 | Molex |
Description: R/A HDR 15 GOLD 2X4CKT Packaging: Tray Features: Board Lock Connector Type: Header Voltage Rating: 600VAC/DC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Through Hole, Right Angle Number of Positions: 8 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 125°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.291" (7.40mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
на замовлення 2108 шт: термін постачання 21-31 дні (днів) |
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212528-0801 | Molex | Headers & Wire Housings Micro-Fit Plus R/A Hdr DR 8Ckt |
на замовлення 5404 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||||||
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212528-0801 | MOLEX |
Description: MOLEX - 212528-0801 - Stiftleiste, Wire-to-Board, 3 mm, 2 Reihe(n), 8 Kontakt(e), Durchsteckmontage, abgewinkelt tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Nennkontaktstrom: 12A Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupferlegierung isCanonical: Y Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 8Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: Micro-Fit+ 212528 Series productTraceability: No Kontaktanschluss: Durchsteckmontage, abgewinkelt usEccn: EAR99 Steckverbinderausrichtung: Abgewinkelt Anzahl der Reihen: 2Reihe(n) Steckverbindermaterial: LCP (Flüssigkristallpolymer), glasfaserverstärkt Rastermaß: 3mm |
на замовлення 436 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. |
| 2125280801 |
|
Виробник: Molex
Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry Thru-Hole Tray
Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry Thru-Hole Tray
на замовлення 2483 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 43+ | 330.22 грн |
| 95+ | 325.52 грн |
| 200+ | 318.93 грн |
| 400+ | 302.10 грн |
| 1500+ | 273.84 грн |
| 2125280801 |
|
Виробник: Molex
Description: R/A HDR 15 GOLD 2X4CKT
Packaging: Tray
Features: Board Lock
Connector Type: Header
Voltage Rating: 600VAC/DC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole, Right Angle
Number of Positions: 8
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.125" (3.18mm)
Insulation Height: 0.291" (7.40mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
Description: R/A HDR 15 GOLD 2X4CKT
Packaging: Tray
Features: Board Lock
Connector Type: Header
Voltage Rating: 600VAC/DC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole, Right Angle
Number of Positions: 8
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.125" (3.18mm)
Insulation Height: 0.291" (7.40mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
на замовлення 2108 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 373.43 грн |
| 10+ | 305.28 грн |
| 100+ | 259.48 грн |
| 750+ | 211.25 грн |
| 1500+ | 201.18 грн |
| 212528-0801 |
Виробник: Molex
Headers & Wire Housings Micro-Fit Plus R/A Hdr DR 8Ckt
Headers & Wire Housings Micro-Fit Plus R/A Hdr DR 8Ckt
на замовлення 5404 шт:
термін постачання 21-30 дні (днів)
| 212528-0801 |
Виробник: MOLEX
Description: MOLEX - 212528-0801 - Stiftleiste, Wire-to-Board, 3 mm, 2 Reihe(n), 8 Kontakt(e), Durchsteckmontage, abgewinkelt
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Nennkontaktstrom: 12A
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 8Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: Micro-Fit+ 212528 Series
productTraceability: No
Kontaktanschluss: Durchsteckmontage, abgewinkelt
usEccn: EAR99
Steckverbinderausrichtung: Abgewinkelt
Anzahl der Reihen: 2Reihe(n)
Steckverbindermaterial: LCP (Flüssigkristallpolymer), glasfaserverstärkt
Rastermaß: 3mm
Description: MOLEX - 212528-0801 - Stiftleiste, Wire-to-Board, 3 mm, 2 Reihe(n), 8 Kontakt(e), Durchsteckmontage, abgewinkelt
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Nennkontaktstrom: 12A
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 8Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: Micro-Fit+ 212528 Series
productTraceability: No
Kontaktanschluss: Durchsteckmontage, abgewinkelt
usEccn: EAR99
Steckverbinderausrichtung: Abgewinkelt
Anzahl der Reihen: 2Reihe(n)
Steckverbindermaterial: LCP (Flüssigkristallpolymer), glasfaserverstärkt
Rastermaß: 3mm
на замовлення 436 шт:
термін постачання 21-31 дні (днів)