214-3339-00-0602J 3M
Виробник: 3M
Description: 3M - 214-3339-00-0602J - IC- & Baustein-Sockel, 14 Kontakt(e), DIP-Sockel, 2.54 mm, Text Tool, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 14Kontakt(e)
Steckverbinder: DIP-Sockel
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: Text Tool
Відгуки про товар
Написати відгук
Технічний опис 214-3339-00-0602J 3M
Description: CONN IC DIP SOCKET ZIF 14POS GLD, Packaging: Tube, Features: Closed Frame, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції 214-3339-00-0602J
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
214-3339-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 14POS GLD Packaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
 |
214-3339-00-0602J | 3M Electronic Solutions Division |
IC & Component Sockets 0.100" DIP SOCKET 14 Contact Qty. |
товару немає в наявності |
В кошику од. на суму грн. |
| 214-3339-00-0602J |
|
Виробник: 3M
Description: CONN IC DIP SOCKET ZIF 14POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 14POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 214-3339-00-0602J |
|
Виробник: 3M Electronic Solutions Division
IC & Component Sockets 0.100" DIP SOCKET 14 Contact Qty.
IC & Component Sockets 0.100" DIP SOCKET 14 Contact Qty.
товару немає в наявності
В кошику
од. на суму грн.