216-6278-00-3303 3M Electronic Solutions Division

Description: CONN IC DIP SOCKET ZIF 16POS GLD, Packaging: Tube, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polyether Imide (PEI), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 250.0µin (6.35µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 250.0µin (6.35µm), Contact Material - Post: Beryllium Copper.