Технічний опис 218-7223-55-1902 3M Electronic Solutions Division
Description: CONN SOCKET SOIC 18POS GOLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Contact Material - Mating: Beryllium Copper, Housing Material: Polyethersulfone (PES), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9), Operating Temperature: -55°C ~ 150°C, Type: SOIC, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Contact Finish - Mating: Gold.
Інші пропозиції 218-7223-55-1902
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
|
|
218-7223-55-1902 | 3M |
Description: CONN SOCKET SOIC 18POS GOLDPart Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Finish - Post: Gold Contact Material - Mating: Beryllium Copper Housing Material: Polyethersulfone (PES), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) Operating Temperature: -55°C ~ 150°C Type: SOIC Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk Contact Finish - Mating: Gold |
товару немає в наявності |
В кошику од. на суму грн. |
| 218-7223-55-1902 |
![]() |
Виробник: 3M
Description: CONN SOCKET SOIC 18POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Material - Mating: Beryllium Copper
Housing Material: Polyethersulfone (PES), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 150°C
Type: SOIC
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Finish - Mating: Gold
Description: CONN SOCKET SOIC 18POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Material - Mating: Beryllium Copper
Housing Material: Polyethersulfone (PES), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 150°C
Type: SOIC
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Finish - Mating: Gold
товару немає в наявності
В кошику
од. на суму грн.



