220-2600-00-0602 3M Electronic Solutions Division
Виробник: 3M Electronic Solutions Division
IC & Component Sockets .1" INLINE ZIP STRIP Socket 20 Contct Qty
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Технічний опис 220-2600-00-0602 3M Electronic Solutions Division
Description: CONN SOCKET SIP ZIF 20POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, ZIF (ZIP), Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (1 x 20), Termination: Solder, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції 220-2600-00-0602
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
220-2600-00-0602 | 3M |
Conn ZIP Socket RCP 20 POS 2.54mm Solder ST Thru-Hole Box |
товару немає в наявності |
Мінімальне замовлення: 20 шт В кошику од. на суму грн. |
 |
220-2600-00-0602 | 3M |
Description: CONN SOCKET SIP ZIF 20POS GOLD Packaging: Bulk Mounting Type: Through Hole Type: SIP, ZIF (ZIP) Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (1 x 20) Termination: Solder Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| 220-2600-00-0602 |
|
Виробник: 3M
Conn ZIP Socket RCP 20 POS 2.54mm Solder ST Thru-Hole Box
Conn ZIP Socket RCP 20 POS 2.54mm Solder ST Thru-Hole Box
товару немає в наявності
Мінімальне замовлення: 20 шт
В кошику
од. на суму грн.
| 220-2600-00-0602 |
|
Виробник: 3M
Description: CONN SOCKET SIP ZIF 20POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET SIP ZIF 20POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.