223-PLS18039-16 Aries Electronics


10004-pga-zif-test-and-burn-in-socket.pdf
Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Part Status: Obsolete
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS)
Termination: Solder
Operating Temperature: -65°C ~ 200°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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Технічний опис 223-PLS18039-16 Aries Electronics

Description: CONN SOCKET PGA ZIF GOLD, Part Status: Obsolete, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Finish - Post: Nickel Bronze, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Termination: Solder, Operating Temperature: -65°C ~ 200°C, Type: PGA, ZIF (ZIP), Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.

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223-PLS18039-16 223-PLS18039-16 Виробник : Aries Electronics 10004_pga_zif_test_and_burn_in_socket-1225760.pdf IC & Component Sockets
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