224-7397-55-1902 3M Electronic Solutions Division
| Кількість | Ціна |
|---|---|
| 1+ | 3589.53 грн |
| 10+ | 3006.91 грн |
| 20+ | 2405.13 грн |
| 50+ | 2320.04 грн |
| 100+ | 2214.55 грн |
| 200+ | 2185.72 грн |
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Технічний опис 224-7397-55-1902 3M Electronic Solutions Division
Description: CONN SOCKET SOIC 24POS GOLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Contact Material - Mating: Beryllium Copper, Contact Finish - Mating: Gold, Housing Material: Polyethersulfone (PES), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Operating Temperature: -55°C ~ 150°C, Type: SOIC, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції 224-7397-55-1902
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
224-7397-55-1902 | 3M |
 Description: CONN SOCKET SOIC 24POS GOLDPart Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Finish - Post: Gold Contact Material - Mating: Beryllium Copper Contact Finish - Mating: Gold Housing Material: Polyethersulfone (PES), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -55°C ~ 150°C Type: SOIC Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. |
| 224-7397-55-1902 |
|
Виробник: 3M
Description: CONN SOCKET SOIC 24POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Housing Material: Polyethersulfone (PES), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 150°C
Type: SOIC
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN SOCKET SOIC 24POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Housing Material: Polyethersulfone (PES), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 150°C
Type: SOIC
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.