224-7397-55-1902 3M
Виробник: 3M
Description: CONN SOCKET SOIC 24POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SOIC
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyethersulfone (PES), Glass Filled
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
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Технічний опис 224-7397-55-1902 3M
Description: CONN SOCKET SOIC 24POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SOIC, Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyethersulfone (PES), Glass Filled, Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції 224-7397-55-1902
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
224-7397-55-1902 | 3M Electronic Solutions Division |
IC & Component Sockets BURN-IN SOIC SOCKET 24 Leads |
товару немає в наявності |
В кошику од. на суму грн. |
| 224-7397-55-1902 |
|
Виробник: 3M Electronic Solutions Division
IC & Component Sockets BURN-IN SOIC SOCKET 24 Leads
IC & Component Sockets BURN-IN SOIC SOCKET 24 Leads
товару немає в наявності
В кошику
од. на суму грн.