228-1371-00-0602J 3M Electronic Solutions Division
| Кількість | Ціна |
|---|---|
| 1+ | 2857.61 грн |
| 10+ | 2394.87 грн |
| 30+ | 1818.34 грн |
| 50+ | 1763.83 грн |
| 100+ | 1717.01 грн |
| 250+ | 1668.79 грн |
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Технічний опис 228-1371-00-0602J 3M Electronic Solutions Division
Description: CONN IC DIP SOCKET ZIF 28POS GLD, Features: Closed Frame, Packaging: Tray, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції 228-1371-00-0602J
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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228-1371-00-0602J | Виробник : 3M |
 Conn DIP Socket RCP 28 POS 2.54mm Solder ST Thru-Hole |
товару немає в наявності |
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228-1371-00-0602J | Виробник : 3M |
Description: CONN IC DIP SOCKET ZIF 28POS GLD Features: Closed Frame Packaging: Tray Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
товару немає в наявності |