228-4817-00-0602J 3M
Виробник: 3M
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 32 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
1+ | 2140.92 грн |
10+ | 1805.52 грн |
25+ | 1727.46 грн |
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Технічний опис 228-4817-00-0602J 3M
Description: CONN IC DIP SOCKET ZIF 28POS GLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції 228-4817-00-0602J за ціною від 1461.73 грн до 2302.8 грн
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ | ||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
228-4817-00-0602J | Виробник : 3M Electronic Solutions Division | IC & Component Sockets 0.100" DIP SOCKET 28 Contact Qty. |
на замовлення 40 шт: термін постачання 21-30 дні (днів) |
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228-4817-00-0602J | Виробник : 3M Interconnect Solutions | Conn DIP Socket SKT 28 POS 2.54mm Solder ST Thru-Hole Box |
товар відсутній |
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228-4817-00-0602J | Виробник : 3M Interconnect Solutions | Conn DIP Socket SKT 28 POS 2.54mm Solder ST Thru-Hole Box |
товар відсутній |