232-1270-01-0602 3M Interconnect Solutions
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Технічний опис 232-1270-01-0602 3M Interconnect Solutions
Description: CONN SOCKET PGA ZIF 32POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, ZIF (ZIP), Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Obsolete.
Інші пропозиції 232-1270-01-0602
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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232-1270-01-0602 | Виробник : 3M |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Obsolete |
товару немає в наявності |
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232-1270-01-0602 | Виробник : 3M Electronic Solutions Division |
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товару немає в наявності |