232-1270-02-0602 3M Electronic Solutions Division
Виробник: 3M Electronic Solutions Division
IC & Component Sockets .050X.100 ZIPSTP SKT 32 CONTACTS PTRN 2
| Кількість | Ціна |
|---|---|
| 1+ | 3547.69 грн |
| 5+ | 3309.38 грн |
| 10+ | 2745.51 грн |
| 20+ | 2630.18 грн |
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Технічний опис 232-1270-02-0602 3M Electronic Solutions Division
Description: CONN SOCKET PGA ZIF 32POS GOLD, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polysulfone (PSU), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 32 (2 x 16), Operating Temperature: -55°C ~ 125°C, Type: PGA, ZIF (ZIP), Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції 232-1270-02-0602
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 232-1270-02-0602 | 3M |
Description: CONN SOCKET PGA ZIF 32POS GOLD Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polysulfone (PSU), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 32 (2 x 16) Operating Temperature: -55°C ~ 125°C Type: PGA, ZIF (ZIP) Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. |
| 232-1270-02-0602 |
|
Виробник: 3M
Description: CONN SOCKET PGA ZIF 32POS GOLD
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polysulfone (PSU), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN SOCKET PGA ZIF 32POS GOLD
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polysulfone (PSU), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: PGA, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.