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232-1291-00-0602J

232-1291-00-0602J 3M Electronic Solutions Division

3mtm-textooltm-shrink-zi-dip-test-and-burn-in-socket-ts0366.pdf
Виробник: 3M Electronic Solutions Division
IC & Component Sockets 0.070" DIP SOCKET 32 Contact Qty.
на замовлення 12 шт:
термін постачання 21-30 дні (днів)
В кошику  од. на суму  грн.
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Технічний опис 232-1291-00-0602J 3M Electronic Solutions Division

Description: CONN IC DIP SOCKET ZIF 32POS GLD, Termination: Press-Fit, Number of Positions or Pins (Grid): 32 (2 x 16), Operating Temperature: -55°C ~ 125°C, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Pitch - Mating: 0.070" (1.78mm), Housing Material: Polysulfone (PSU), Glass Filled, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Mounting Type: Connector, Features: Closed Frame, Packaging: Bulk.

Інші пропозиції 232-1291-00-0602J

Фото Назва Виробник Інформація Доступність Ціна без ПДВ
232-1291-00-0602J 232-1291-00-0602J 3M 3mtm-textooltm-shrink-zi-dip-test-and-burn-in-socket-ts0366.pdf Description: CONN IC DIP SOCKET ZIF 32POS GLD
Termination: Press-Fit
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Pitch - Mating: 0.070" (1.78mm)
Housing Material: Polysulfone (PSU), Glass Filled
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Mounting Type: Connector
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
 Мінімальне замовлення: 20 шт
В кошику  од. на суму  грн.
232-1291-00-0602J 3mtm-textooltm-shrink-zi-dip-test-and-burn-in-socket-ts0366.pdf
232-1291-00-0602J
Виробник: 3M
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Termination: Press-Fit
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Pitch - Mating: 0.070" (1.78mm)
Housing Material: Polysulfone (PSU), Glass Filled
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Mounting Type: Connector
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 20 шт
В кошику  од. на суму  грн.