239-5605-02-0602 3M Interconnect Solutions
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Технічний опис 239-5605-02-0602 3M Interconnect Solutions
Description: CONN ZIG-ZAG 39POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: Zig-Zag, Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 39 (1 x 19, 1 x 20), Termination: Solder, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper.
Інші пропозиції 239-5605-02-0602
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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239-5605-02-0602 | Виробник : 3M Interconnect Solutions |
 Conn ZIP Socket SKT 39 POS 2.54mm Solder ST Thru-Hole Box |
товару немає в наявності |
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| 239-5605-02-0602 | Виробник : 3M |
Description: CONN ZIG-ZAG 39POS GOLD Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: Zig-Zag Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 39 (1 x 19, 1 x 20) Termination: Solder Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper |
товару немає в наявності |
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| 239-5605-02-0602 | Виробник : 3M Electronic Solutions Division |
IC & Component Sockets ZIP STRIP SOCKETS .100" |
товару немає в наявності |