24-3553-10 Aries Electronics
| Кількість | Ціна |
|---|---|
| 1+ | 1227.40 грн |
| 10+ | 1048.01 грн |
| 20+ | 863.94 грн |
| 50+ | 851.40 грн |
| 100+ | 751.07 грн |
| 200+ | 700.90 грн |
| 500+ | 686.27 грн |
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Технічний опис 24-3553-10 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN, Pitch - Post: 0.100" (2.54mm), Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції 24-3553-10
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 24-3553-10 | Виробник : Aries Electronics |
 Description: CONN IC DIP SOCKET ZIF 24POS TINPitch - Post: 0.100" (2.54mm) Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
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