24-526-10 Aries Electronics
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 29 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
1+ | 796.85 грн |
17+ | 680.12 грн |
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Технічний опис 24-526-10 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції 24-526-10 за ціною від 998.68 грн до 1343.32 грн
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ | ||||||
---|---|---|---|---|---|---|---|---|---|---|---|
24-526-10 | Виробник : ARIES |
Description: ARIES - 24-526-10 - IC- & Baustein-Sockel, 24 Kontakt(e), DIP, 2.54 mm, 526, 15.24 mm, Berylliumkupfer tariffCode: 85366930 productTraceability: No Kontaktüberzug: Verzinnte Kontakte Steckverbindertyp: DIP rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 24Contacts euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 15.24mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: 526 SVHC: No SVHC |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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24-526-10 | Виробник : Aries Electronics | IC & Component Sockets 24 PIN W/HANDLE |
на замовлення 19 шт: термін постачання 21-30 дні (днів) |