24-6556-11 Aries Electronics

Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна |
---|---|
1+ | 1297.56 грн |
10+ | 1107.62 грн |
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Технічний опис 24-6556-11 Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass, Part Status: Active.
Інші пропозиції 24-6556-11
Фото | Назва | Виробник | Інформація |
Доступність |
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24-6556-11 | Виробник : Aries Electronics |
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