24-6570-10 Aries Electronics
| Кількість | Ціна |
|---|---|
| 1+ | 1276.98 грн |
| 11+ | 1017.57 грн |
| 22+ | 815.86 грн |
| 55+ | 815.17 грн |
| 110+ | 738.53 грн |
| 253+ | 712.75 грн |
| 506+ | 700.90 грн |
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Технічний опис 24-6570-10 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції 24-6570-10
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 24-6570-10 | Виробник : Aries Electronics |
 Description: CONN IC DIP SOCKET ZIF 24POS TINPart Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
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