25MF225KB13225 Rubycon
Виробник: Rubycon
Description: CAP FILM 2.2UF 10% 25VDC 1210
Packaging: Cut Tape (CT)
Tolerance: ±10%
Features: High Temperature
Package / Case: 1210 (3225 Metric)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Applications: General Purpose
Termination: Solder Pads
Dielectric Material: Polymer, Metallized
Voltage Rating - DC: 16V
Height - Seated (Max): 0.063" (1.60mm)
Capacitance: 2.2 µF
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
| Кількість | Ціна |
|---|---|
| 1+ | 382.78 грн |
| 10+ | 268.52 грн |
| 50+ | 228.61 грн |
| 100+ | 202.95 грн |
| 500+ | 185.74 грн |
Відгуки про товар
Написати відгук
Технічний опис 25MF225KB13225 Rubycon
Description: CAP FILM 2.2UF 10% 25VDC 1210, Packaging: Tape & Reel (TR), Tolerance: ±10%, Features: High Temperature, Package / Case: 1210 (3225 Metric), Mounting Type: Surface Mount, Operating Temperature: -55°C ~ 125°C, Applications: General Purpose, Termination: Solder Pads, Dielectric Material: Polymer, Metallized, Voltage Rating - DC: 16V, Height - Seated (Max): 0.063" (1.60mm), Capacitance: 2.2 µF, Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm).
Інші пропозиції 25MF225KB13225
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
|
|
25MF225KB13225 | Виробник : Rubycon |
Description: CAP FILM 2.2UF 10% 25VDC 1210 Packaging: Tape & Reel (TR) Tolerance: ±10% Features: High Temperature Package / Case: 1210 (3225 Metric) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Applications: General Purpose Termination: Solder Pads Dielectric Material: Polymer, Metallized Voltage Rating - DC: 16V Height - Seated (Max): 0.063" (1.60mm) Capacitance: 2.2 µF Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) |
товару немає в наявності |