Технічний опис 260-5204-01 3M Interconnect Solutions
Description: CONN SOCKET QFN 60POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: QFN, Number of Positions or Pins (Grid): 60 (4 x 15), Termination: Solder, Housing Material: Polyethersulfone (PES), Pitch - Mating: 0.020" (0.50mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.020" (0.50mm), Contact Finish - Post: Gold, Contact Material - Post: Beryllium Copper.
Інші пропозиції 260-5204-01
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 260-5204-01 | Виробник : 3M Interconnect Solutions |
 Conn QFN Socket SKT 60 POS Solder ST Thru-Hole Box |
товару немає в наявності |
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260-5204-01 | Виробник : 3M |
Description: CONN SOCKET QFN 60POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: QFN Number of Positions or Pins (Grid): 60 (4 x 15) Termination: Solder Housing Material: Polyethersulfone (PES) Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.020" (0.50mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper |
товару немає в наявності |
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260-5204-01 | Виробник : 3M Electronic Solutions Division |
IC & Component Sockets Textool QFN .5MM,60P ODD ROW, W/THRML PIN |
товару немає в наявності |