Технічний опис 264-1300-00-0602J 3M Electronic Solutions Division
Description: CONN IC DIP SOCKET ZIF 64POS GLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Connector, Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 64 (2 x 32), Termination: Press-Fit, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.070" (1.78mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції 264-1300-00-0602J за ціною від 2676.88 грн до 3270.49 грн
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264-1300-00-0602J | Виробник : 3M |
 Description: CONN IC DIP SOCKET ZIF 64POS GLDFeatures: Closed Frame Packaging: Tube Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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264-1300-00-0602J | Виробник : 3M |
Conn DIP Socket SKT 64 POS 1.78mm Solder ST Thru-Hole Box |
товару немає в наявності |