264-1300-29-0602J 3M Electronic Solutions Division
Виробник: 3M Electronic Solutions DivisionIC & Component Sockets RECPT FOR DIP SOCKET 64 Contact Qty.
на замовлення 7 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 3354.17 грн |
| 10+ | 2261.99 грн |
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Технічний опис 264-1300-29-0602J 3M Electronic Solutions Division
Description: 3M TEXTOOL RECEPTACLES FOR DIP S, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.8" (20.32mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 64 (2 x 32), Termination: Solder, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.070" (1.78mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper.
Інші пропозиції 264-1300-29-0602J
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 264-1300-29-0602J | Виробник : 3M Interconnect Solutions |
Conn DIP Socket SKT 64 POS 1.78mm Solder ST Thru-Hole Box |
товару немає в наявності |
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| 264-1300-29-0602J | Виробник : 3M |
Description: 3M TEXTOOL RECEPTACLES FOR DIP S Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.8" (20.32mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Solder Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper |
товару немає в наявності |